Kemampuan Desain
| Lapisan desain maksimal | 40 lapisan |
| Cacah pin maks | 60.000 |
| Sambungan maks | 40.000 |
| Jembar baris minimal | 3 mil |
| Jarak baris minimal | 3 mil |
| Minimal liwat | 6 mil (bor laser 3 mil) |
| Jarak pin maksimal | 0,44mm |
| Konsumsi daya maksimal / PCB | 360W |
| HDI Mbangun | 1 + n + 1; 2 + N + 2, X + N + X, HDI lapisan apa wae ing R&D |
Kapabilitas Pangiriman
| Jumlah pin | Pangiriman (Dina Kerja) |
| 0-2,000 | 3-5 |
| 2.000-4.000 | 5-8 |
| 4.000-6.000 | 8-12 |
| 6.000-8,000 | 12-15 |
| 8.000-10.000 | 15-18 |
| 10.000-12.000 | 18-20 |
| 12.000-14.000 | 20-22 |
| 14.000-16.000 | 22-25 |